Odisha to break ground on India’s First Advanced 3D Chip Packaging Unit

Odisha is set to host India's first Advanced Glass Semiconductor Packaging Unit by Heterogenous Integration Packaging Solutions (3D Glass Solutions) in Bhubaneswar.

This ₹1,943 crore project, breaking ground on April 19, 2026, introduces advanced 3D Heterogeneous Integration technology, making Odisha the first state with both a compound semiconductor fab and an advanced 3D packaging facility. It aims to boost India's semiconductor manufacturing for key sectors like aerospace and AI, aligning with the Atmanirbhar Bharat vision.